Diamond grinding wheels have the characteristics of high hardness, high compressive strength, and good wear resistance, making them an ideal tool for processing hard and brittle non-metallic materials and cemented carbide. They are widely used in glass, ceramics, magnetic materials, integrated circuits, gemstones, etc. Processing of stone, wall and floor tiles, concrete, refractory materials and other fields;

Compared with the use of general abrasive grains such as boron carbide, silicon carbide, corundum, etc., grinding wheels made of diamond abrasive grains have the characteristics of sharp edge angles, long service life, high productivity, and good processing quality, but they are more expensive; therefore, , is actually mostly used in fine grinding of hard alloys, ceramics, semiconductors and other materials with high hardness, brittleness and difficulty in machining.

The bonding agent of diamond grinding wheels can be divided into four types according to their bonding and wear resistance: resin, ceramic, bronze, electroplated metal, etc. In general applications, ceramic bonded grinding wheels and resin bonded grinding wheels are more commonly used.

For example: PCD diamond flakes, PCBN cubic boron nitride flakes, carbide or ceramic tools, etc. use ceramic bond diamond grinding wheels; their overall performance is between resin grinding wheels and bronze grinding wheels, such as: better durability than resin grinding wheels. Sharper than bronze grinding wheels;

Resin bonded diamond grinding wheels are mainly used for grinding high and hard alloys and non-metallic materials, cutting hard and brittle carbide, non-metallic minerals, etc. Such as carbide, ceramics, agate, optical glass, semiconductor materials, wear-resistant cast iron, stone, etc.

The selection of diamond grinding wheels mainly refers to factors such as abrasive, particle size, hardness, concentration, shape and size;

The abrasives are various types of artificial diamond (JR). The model can be selected according to the specific use by referring to the crystal shape and particle strength of the abrasive. The selection of particle size should comprehensively consider three factors: workpiece roughness, grinding productivity and diamond consumption;

High-concentration diamond grinding wheels have strong ability to maintain shape, while low-concentration grinding wheels consume less diamonds. The selection of concentration needs to consider actual use needs; the shape and size of the grinding wheel need to consider: the shape, size and other conditions of the grinding machine and workpiece;

If resin bonded diamond grinding wheels are used, the "hardness" properties also need to be considered. Generally, S (Y1) level and above are used more often.

The firing temperature of ceramic bond is very high and diamond abrasives cannot withstand it. The development of low-temperature ceramic bond has not made much progress yet. At present, the market mainly uses: adding thermal conductivity and toughness fillers such as copper powder to resin grinding wheels to improve heat resistance and durability, and adding brittle fillers to bronze grinding wheels to improve self-sharpening. These two modified grinding wheel solutions replace ceramic bonding. The use of agent grinding wheels also takes up the application position of some ceramic diamond grinding wheels.